Silicon Valley Microelectronics, Inc. (SVM) services

Back grinding is a process that removes silicon from the back surface of a wafer.  SVM provides grinding on our own substrates or on customer supplied wafers. We process bare and device patterned wafers with high yield and offer wafer thinning to customer specifications.

SVM provides wafer lapping services when there is a need to remove bulk amounts of silicon from a wafer substrate. Bulk silicon removal is often required in wafer reclaim and for thinning projects. SVM provides lapping for all wafer diameters 50mm to 300mm.

SVM provides SEMI standard and custom wafer laser marking services. SEMI standard markings include, but are not limited to, M12, M13 and T7 marks commonly found on all silicon wafer substrates. Quality is comparable to major silicon wafer foundry marks.

SVM has strategic partnerships with the world’s largest silicon wafer manufacturing companies. Although 99% of wafer materials shipped are major manufacturer factory sealed, SVM does offer wafer polishing solutions.

SVM provides all levels of wafer reclaim from a technically advanced low particle, super flat reclaim to the simplest strip and polish producing handling grade wafers with a clear polished surface.   Wafers which flow through SVM advanced reclaim programs successfully characterize 45nm particles and site flatness at 0.13um.

SVM provides Wafer Downsizing solutions on bare wafers or those processed with blanket films or patterns. The two most common methods to downsize a wafer are laser cut down and water-jet cut down. Both processes are performed in an open air environment after which SVM recommends a SEMI standard edge bevel to reduce the chance of edge chipping.