Silicon Valley Microelectronics, Inc. (SVM)
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Wafer Polishing Services
SVM has strategic partnerships with the world’s largest silicon wafer manufacturing companies. Although 99% of wafer materials shipped are major manufacturer factory sealed, SVM does offer wafer polishing solutions.
The following polishing services are available:
- Wafer Diameters: 25mm (1 inch) – 300mm (12 inch)
- Single side polishing (SSP)
- Double side polishing through simultaneous or “flip” polishing techniques ( DSP)
- Backside polishing
- Kiss Polishing – Light polish which will remove minor surface scratches or defects
- Chemical Mechanical Planarization (CMP) of patterned wafer substrates and/or blanket films
- Typical Yield: >=95%
Wafer polishing is available on virgin or reclaim silicon wafer substrates. Please reference the WAFER RECLAIM section of this website for information on SVM’s Wafer Reclaim service solutions.