Synova S.A.

SYNOVA S.A., headquartered in Duillier, Switzerland, manufactures advanced laser cutting systems that incorporate its proprietary water jet guided laser technology (Laser MicroJet) in a true industrial CNC platform. Customers benefit from significant yield and improved cutting quality as well as enhanced capabilities for precision machining a wide range of materials. Since 1998, various industries worldwide have switched to this laser process for their production needs. In addition, the particular advantages have led to a number of new applications such as in the domain of sensitive material processing where Synova was the first company to introduce the laser into semiconductor wafer dicing in 2001.