Quality Assurance for Wafer-Based Layer-Systems

QUALITY ASSURANCE FOR WAFER-BASED LAYER-SYSTEMS SURAGUS offers systems for non-contact quality assurance and process monitoring of wafer and wafer metallization properties. Applications are inline and offline assessment of sheet resistance, wafer resistance and metallization thickness measurement. EddyCus® TF inline solutions enable high throughput quality assurance and process control of doping and coating processes. Benefits are optimized target utilization, increased tool throughput and controlled product quality. Additionally, EddyCus® TF lab systems provide insights for material and process developers that focus on the development of cost-effective, fast and uniform deposition and doping processes. Further, mapping systems, with high local resolution, are beneficial to assess uniformity of samples and to identify various local effects and defects such as cracks, impurities or process inhomogeneities. SURAGUS GmbH Maria-Reiche-Str. 1 01109 Dresden Germany E-Mail: info@suragus.com Phone: +49 (0) 351 273 598 01 Fax: +49 (0) 351 329 920 58 www.suragus.com Understanding conducive layers. SURAGUS GmbH | Maria-Reiche-Str. 1 | D-01109 Dresden | Germany | Phone +49 351 273 598 - 01 | Fax + 49 351 329 920 - 58 | info@suragus.com | www.suragus.com SHEET RESISTANCE MEASUREMENT SURAGUS offers non-destructive and non-contact systems for inline and off-line quality assurance and process control based on the eddy current testing method. CONDUCTIVITY MAPPING AND DEFECT ANALYSIS SURAGUS offers systems for quality assurance and process monitoring in order to ensure optimal and homogeneous wafer and metallization quality. Spatially resolved impedance spectroscopy provides local information on electric properties across the wafer and assesses the homogeneity. High local conductivity layer changes may expose local effects and defects. ? Sheet resistance and layer thickness determination of backside metallization in photovoltaic cells ? Determining the conductivity and the sheet resistance of wafers ? Quality assurance of doping processes ? Quality assurance of metallization, e.g. Aluminum, Molybdenum, Zinc, Copper, Silver, etc. APPLICATIONS + Monitoring of the sheet resistance and uniformity of conductivity + Maximizing the machine throughput + Higher target yield by efficient material utilization + In- and outgoing product inspection + Material cost reductions through process optimization VALUE ADD ? Cracks ? Inclusions, impurities ? Specific application effect such as ‘‘finger errors“ in PV ? Layer thicknesses and layer resistance fluctuations ? Changes in oxide content ? Selective emitter / doping effects DETECTABLE EFFECTS AND DEFECTS + Inspection of incoming semi-finished products + Avoiding costs resulting from errors + Assuring product integrity + Detection of potentially problematic layers/processes VALUE ADD PRODUCT ? EddyCus TF map 2020/4040/6060 (mapping solution for sheet resistance and defect mapping) ? EddyCus® TF lab (laboratory device for single, immediate wafer/sheet resistance measurements) ? EddyCus® TF inline (inline device for continuous, immediate wafer/sheet resistance measurements) PRODUCTS ? Mapping of sheet resistance of wafer or wafer metallization ? Mapping and characterization of doped zones (e.g. selective emitters) ? Homogeneity mapping and error detection e.g. impurities and cracks ? Thickness mapping APPLICATIONS EddyCus® TF Control Eddy Current Sensor EC-Scan EddyCus® TF map 6060 EddyCus® TF inline ex-vacu EddyCus® TF lab