Strasbaugh 7AA - Data Sheet

The model 7AA fully-automatic wafer grinder is an automated in-feed grinder capable of grinding wafers ranging from 75 to 150mm in diameter. The 7AA combines proven vertical down-feed grinding technology with force adaptive grinding. The 7AA lowers the diamond wheels onto the wafer limiting the total downforce that can be applied to the wafer to a predetermined maximum. This protects the machine, the diamond wheels, and your valuable product from being overstressed, yet allows the machine to grind at its maximum possible rate. The 7AA also uses closed loop thickness control to reduce thickness errors and eliminate regrinds. Through continuous monitoring the computer determines if the final thickness varies from the target thickness and adjusts the grind spindle position.