10th Bondexpo – International Trade Fair for Bonding Technology

The strong development of Bondexpo is a testament to its pioneering role in the industry, which will continue to increase in the future – particularly as the collection of issues concerning bonding and joining new materials now and in the future represents a real challenge for “adhesion technology”. After all, lightweight construction is an issue not only in motor vehicles but also in instruments and equipment. Future materials and material combinations as well as hybrid solutions offer ratio and resource potentials that can be realised only with the use of new adhesives.

Bondexpo conveys the stage of development and the know-how between research and development, use and application, and leads the way in future adhesion, insulation, foaming, sealing and moulding technology. In the trade fair group with the concurrent Motek, the complex topic of adhesion, dosing and applying is presented not in isolation but rather in the context of production technology. Ultimately, the adhesion, moulding, sealing and foaming processes are also ideally suited to highly automated processing by handling and robot systems. In turn, these can be found in all forms at Motek, the world’s leading international trade fair for assembly, handling technology and automation. This combination, which is absolutely routed in practice, is globally unique and guarantees users the best possible information as well as optimum benefit.