FirstNano - Model Easytube 3000Ext -Advanced CVD Systems
The EasyTube® 3000 series advanced CVD systems are our best-selling and most capable product for university labs and industry R&D facilities. The base system includes a cylindrical quartz process tube which can be from 70 mm to 130 mm ID depending on the desired substrate size. A range of optional modules can be configured to meet the specific requirements of the end user. Many of the options are available as upgrades after installation. The EasyTube® 3000EXT model has an extended frame size to accommodate the larger system modules. These can include a glovebox, loadlock, a rolling furnace for rapid heating and cooling, an upstream RF plasma generator, and/or an option to increase the process chamber ID up to 200 mm to accommodate full 6” wafers.
- CVDWinPrC™ system control software for realtime process control, data logging, and recipe editing
- Preprogrammed process recipes
- Substrate sizes up to 150 mm x 150 mm (batch processing of multiple wafers per run also possible)
- Cantilevered automatic substrate loading/unloading system
- Up to 16 mass flow-controlled UHP gas lines
- Atmospheric and/or low pressure process configurations available
- 3-zone resistance furnace for temperatures up to 1200 °C or optional infrared/radio frequency induction heating
- Proprietary realtime cascade process temperature control
- High throughput with FastCool™ furnace
- User ability to set warnings and alarms
- Comprehensive software and hardware safety interlocks
- 1 year warranty
- On-site system startup and training
- Semi - S2/S8 and CE Compliant
- High temperature resistance furnace up to > 1200 °C
- Infrared heating for rapid thermal processing > 1100 °C
- Radio frequency induction heating for process temperatures > 1500 °C
- Upstream plasma
- DC bias field assisted growth
- Substrate rotation for improved process uniformity
- Rectangular process tube for improved laminar gas flow
- Liquid/solid source vapor delivery kit
- Bubbler liquid auto refill
- Run/vent: stabilizes gas flows (bypassing the process tube) before flowing into process tube
- Loadlock to isolate the process tube from ambient atmosphere
- Glovebox with exhausted N2 or Ar purge
- High vacuum process chamber and/or loadlock chamber
- Residual gas analyzer
- Air to water heat exchanger for cooling water
- EasyGas™ hazardous gas cabinets
- EasyPanel™ UHP gas panels for argon, nitrogen, helium, oxygen
- EasyExhaust™ exhaust gas conditioning system (scrubber/pyrolyzer)