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Argotech - Die-Attach Technologies
FromArgotech a.s.
Die-Attach represents a wide technology group for component placement and attaching with adhesive, solder or other compounds. Each group requires a specific approach, plus equipment, technology and skilled personnel.
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We operate with a wide range of technologies that enable us to process traditional or high-tech components and offer the most efficient solutions. Especially the following:
- technologies for both face-up and face-down attach (flip-chip)
- bonding with UV, optical, thermal or electrical conductive adhesives
- soldering using hot tool or laser assisted local soldering
- thermo-compression using stud bumping
- solder ball jetting for ultra-high precision flip-chip applications
precise dispensing and stamping
Parameters:
- placement accuracy up to 0.5µm
- component (bare die) size from 150 x 150µm
Typical applications:
Laser diode attach on interposer, PIC attach, component sorting, EIC flip-chip on PIC