Argotech a.s. products

Die-Attach represents a wide technology group for component placement and attaching with adhesive, solder or other compounds. Each group requires a specific approach, plus equipment, technology and skilled personnel.

Wire bonding has been the most commonly used method for component interconnection with substrate, PCB or package module. The most standard is the ball bonding with ball/wedge method. We can process also full ball stich on ball (BSOB) or wedge/wedge method.