- Home
- Companies
- Nordson TEST & INSPECTION
- Products
- Nordson - Model AMI SpinSAM - Automated ...
Nordson - Model AMI SpinSAM -Automated Inspection Tool
The SpinSAM automated inspection tool delivers high throughput and better sensitivity for accurately locating defects in wafer based assemblies. Ideal applications include bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, over-molded wafers and more. Efficiently spin scan up to 4 wafers simultaneously with 4 matched transducers, wafers can be inspected over the widest frequency range ever achieved in a production environment. Waterfall transducer provides non-immersion scanning which minimizes risks of contamination and false bond indications.
- Industry leading throughput on four 300mm wafer inspection
- Best in class footprint / UPH
- Leading defect capture and image quality
- Modular design for ease of serviceability
- Fully automated inspection and analysis with factory communication
- In the fast-paced world of semiconductor manufacturing, precision and efficiency are non-negotiable.
- Introducing SpinSAM - the pinnacle of automated inspection technology designed to meet the
- rigorous demands of the industry. SpinSAM is a game-changer with high throughput and
- unparalleled sensitivity. The system has an innovative spin scan method,
- meticulously engineered to maximize Units Per Hour (UHP),
- means inspecting 41 wafers per hour without compromising accuracy.
- From bonded wafers to MEMS and everything in between.
- SpinSAM handles it all with ease.
What is SpinSAM?
Spin Scanning Acoustic Microscopy
The SpinSAM automated inspection tool delivers high throughput and better sensitivity for accurately locating defects in wafer based assemblies. Ideal applications include bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, over-molded wafers and more. Efficiently spin scan up to 4 wafers simultaneously with 4 matched transducers, wafers can be inspected over the widest frequency range ever achieved in a production environment. Waterfall transducer provides non-immersion scanning which minimizes risks of contamination and false bond indications.
Every Second Counts
With SpinSAM, downtime becomes a thing of the past
Ensure continuous operation and peak performance
SpinSAM’s modular design allows for efficient Mean Time to Repair (MTTR)
Any necessary repairs can be swiftly addressed, keeping your production line running smoothly without extended interruptions
Global Tool Matching
Coupled with advanced Global Tool Matching feature, this revolutionary approach ensures that SpinSAM can detect the smallest defects with unparalleled precision, allows you to use the same settings across different SpinSAM systems, guaranteeing matching results regardless of location. With global tool matching, you can maintain uniformity in your inspection process, streamline operations, and achieve unparalleled quality control standards across your entire semiconductor manufacturing ecosystem.
Proprietary Transducer Technology
A constant concern in semiconductor manufacturing is eliminating contamination. SpinSAM`s design features minimal moving parts over the wafer, along with unique waterfall transducers and non-immersion scanning, SpinSAM minimizes the risk of contamination and safeguards the cleanliness of your production environment. Creating complete wafer image with no stitching. This innovative acoustic inspection system guarantees maximum efficiency WITHOUT sacrificing accuracy.