Nordson TEST & INSPECTION products

The SpinSAM automated inspection tool delivers high throughput and better sensitivity for accurately locating defects in wafer based assemblies. Ideal applications include bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, over-molded wafers and more. Efficiently spin scan up to 4 wafers simultaneously with 4 matched transducers, wafers can be inspected over the widest frequency range ever achieved in a production environment. Waterfall transducer provides non-immersion scanning which minimizes risks of contamination and false bond indications.

The most popular acoustic microscope used worldwide for routine laboratory analysis and component screening applications.

The SQ3000 is an all-in-one solution that’s loaded with powerful tools that cover inspection and measurement for Automated Optical Inspection (AOI), Solder Paste Inspection (SPI) and coordinate measurement (CMM) applications.

SQ3000+ Multi-Function System with Multi-Reflection Suppression® (MRS®) sensor technology provides the ultimate combination of high resolution, high accuracy and high speed for inspection and metrology. It remains the only system on the market capable of performing AOI, SPI and CMM in-line.

WX3000 3D and 2D metrology and inspection system provides the ultimate combination of high speed, high resolution and high accuracy for wafer-level and advanced packaging applications to improve yields and productivity. Powered by Multi-Reflection Suppression® (MRS®) Sensor Technology.

Quadra™ Pro series creates unbeatable ultra high resolution images. The in-house designed, high performance Dual Mode NT4 X-ray tube and the Onyx detector provide visibility of even the tiniest detail and finding the defects immediately. Nothing can hide anymore.

Ruby XL X-ray inspection system is the optimum solution for large boards. The unique Nordson TEST & INSPECTION  NT maintenance-free, sealed-transmissive X-ray tube, providing 0.5 μm feature recognition and up to 10 W of target power, together with the 3 Mpixel long lifetime CMOS flat panel detector makes this jewel of a system cover all the failure analysis and manufacturing tasks required in the production environment.

The X-platform series is a dedicated high speed inline automated X-ray inspection system for the inspection of PCB-assembly boards for single/multipanels or samples in trays. The system offers market leading inspection speed and is ideal for low-mix high-volume production environment.

4000Plus bondtester sets the industry standard in bondtesting offering unsurpassed accuracy and repeatability of data, providing complete confidence in results.

Achieve exactly the gap you need, whether you need to set a gap that is perfectly parallel or slightly tilted to achieve the best uniformity. The three AGS sensors each report separate readings from chambers at process pressure in numerical and graphical form to let you achieve exactly the gap you need.