BTBP - Macro Semi 3D Metrology System

• Load & scan the wafer.
• Capture the full wafer for 2D and 3D analysis.
• Recipe setup and binning capability.
• Classify wafer defects and generate highest resolution 3D models for quantitative measurements.
• Detect & display defects like particles, scratches, missing patterns & bumps.

DETECTING THE DEFECTS

• Identifying X, Y location(relative to notch), minimum height, maximum height, average height and diameter of the bump on a wafer.
• Information is saved in the industry standard KLARF format.

BINNING CAPABILITY

• Missing bumps can be identified.
• High quality imaging providing greater detail of intensities for detecting even floor variations & the height of bumps more accurately.

PARTICLES ON WAFER

• Features capable of detecting the presence of particles, residues, damaged wafers, wafer edges, hard & soft defects with their locations, count and size with high binning accuracy.
• 32 Bit High Dynamic Range Process of Scanning: Provides a wide range of intensities for detecting sub micron particles (0.25 microns) to very large particles (many millimeters) with a single scan for front and back of the wafer.
• Automatic classification of defects through our computer algorithm process of deep learning(A.I).

• Follows SEMI Standards for Job Handling
• Recipe Management
• User and Role Management
• Access Control Based on Login
• Defect/Particle Map in Standard Format
• Charting Package for Professional Reporting
• 3D Viewer with Measurements
• Die-to-Die Matching
• 2D and 3D Analysis
• HDR Imaging
• Edge Inspection
• A.I. Available for Classifying Defects & Tagging defects
• Signature Analysis
• Automatic Notch detection