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Comet Group
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  5. Comet - Model CA20 - Submicron 3D ...

Comet - Model CA20 -Submicron 3D X-ray for Advanced Packaging

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The CA20 is designed to deliver superior 2D & 3D images in the highest resolution, it allows the fastest inspection of micron-sized details - and helps cut time to market for complex 3D ICs. The semiconductor sector is a speed-driven industry. In the race for innovation every day counts. As an inspection system specifically developed for the challenges of complex 3D ICs in Advanced Packaging, the CA20 helps you keep the pace - and to stay ahead of the game. The CA20 enables an accelerated verification of new packaging process node prototypes: The faster you find the root cause of ramp-up issues and fix them, the faster you’ll reach the desired yield - and, thus, the Return-on-Invest (ROI). While inspections using destructive methods can take weeks, 3D X-ray gives your R&D engineers results they can work with right away. As a non-destructive testing (NDT) system, the CA20 supplies you with crystal-clear 3-dimensional images of nano details inside your ICs within minutes. Monitor your interconnects process, find flaws fast and feed your insights back into the process. 3D X-ray produces high-resolution 3D volumes that allow manufacturers to measure and inspect bumps and identify smallest defects in record time. See critical defects such as non-wet, head-in-pillow or bump shift and determine the stand-off height to monitor die tilt or warping like never before.
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  • Designed for the semiconductor industry
  • Non-destructive technology for three-dimensional insights into solder bumps within minutes
  • Repeatable results through reliable and accurate technology, designed to support a stable inspection routine
  • Efficient software-assisted review including automated void analysis with Void Insights
  • Dose Manager for the protection of X-ray sensitive components
 

The semiconductor sector is a speed-driven industry. In the race for innovation every day counts. As an inspection system specifically developed for the challenges of complex 3D ICs in Advanced Packaging, the CA20 helps you keep the pace – and to stay ahead of the game. The CA20 enables an accelerated verification of new packaging process node prototypes: The faster you find the root cause of ramp-up issues and fix them, the faster you’ll reach the desired yield – and, thus, the Return-on-Invest (ROI).

 

While inspections using destructive methods can take weeks, 3D X-ray gives your R&D engineers results they can work with right away. As a non-destructive testing (NDT) system, the CA20 supplies you with crystal-clear 3-dimensional images of nano details inside your ICs within minutes. Monitor your interconnects process, find flaws fast and feed your insights back into the process.