DispenseJet - Model DJ-2200 -Spray Valve Jet

The DispenseJet DJ-2200 spray valve jet uses a patented high-precision mechanism to control exact volumes of flux dispensed directly from the nozzle into the substrate. Dot consistency is aided by a built-in heater that controls fluid temperature to facilitate the jetting process. The syringe/reservoir is completely sealed, allowing constant, full pressure at all times. This allows high-speed, non-contact jetting of low-viscosity materials like rosin and no-clean fluxes with sharp, clean cut-off.

Jetting replaces the high-maintenance dipping that is often performed with pick and place equipment. By separating the fluxing and chip placement operations, significant throughput can be achieved in flip chip assembly operations. The jet can also be used for coating with other fluid materials, like photo resist.

Jetting lets you accommodate changes in part styles or substrates without costly downtime and tooling changes. Dispensing parameters can be changed quickly and easily with the dispensing system’s software.

In the jetting process, the jet moves in an X, Y plane to dispense a variety of pre-programmed patterns, which create a uniform film of flux. There is no movement required in the Z-axis during or between the dispense cycles. Time elapsed between cycles is minimized, increasing your throughput and productivity.

The jet is capable of dispensing precise dots and coaxial air-assisted lines and dots. When equipped with the coaxial air option, jetted flux is followed by a pulse of air, which aids flux flow and helps overcome the surface tension present on some substrates and parts.

• Dispenses precise lines and dots of flux for passive and active components
• Changes in part layouts can be accommodated without downtime and tooling changes
• Reduces flux waste and improves material utilization with minimal maintenance
• Separates flux and chip placement operations for higher throughput
• Improves quality of flip chip soldering with lower residues
• Provides micro-dispensing of thin layers of fluid as low as 5 µm (0.2 mils) thick for thin flux materials