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ESI - Model EDX8000T Plus -Plating Solution Analyzer of Metal Elements
Electroplating is a process that uses the principle of electrolysis to deposit a thin layer of metal or alloy on the surface of certain metals. It is a technique that uses electrolysis to attach a metal film to the surface of metal or other materials, thus preventing metal oxidation (such as rusting), increasing wear resistance, conductivity, reflectivity, corrosion resistance (such as copper sulfate), and improving aesthetics. Many coins are also plated with electroplating. In order to improve the corrosion resistance and wear resistance of metals, and extend the service life of machinery, it is often necessary to add a certain amount of metal coating on the surface of machinery parts.
Chromium plating and nickel plating are commonly used methods. There are many factors that affect the quality of the plating, including current density, plating solution temperature, additives, various chemical component contents in the plating solution, and impurities. During the electroplating production process, the chemical component content of the plating solution is constantly changing. To obtain good plating, it is necessary to keep the plating solution composition relatively stable. Therefore, the relative stability of the plating solution is a prerequisite for obtaining good plating, and it is necessary to test and adjust the plating solution during the production process.
The EDX8000T Plus coating thickness gauge is specially designed for the analysis of coating material composition and the measurement of coating thickness. Its main advantages are accuracy, speed, non-destructiveness, simple operation, and fast measurement speed. It can analyze up to five layers of materials thickness at the same time and can quickly identify the material composition of the coating. With this advanced technology, you can confidently measure your materials with ease, speed, and accuracy.
- New down-illuminated integrated design
- Test quickly, no sample preparation required
- The built-in high-definition CCD camera can be used to observe and select the measurement of coating thickness in small areas to avoid direct contact, contamination or damage to the measured object. The software is equipped with a distance correction algorithm to achieve accurate testing of special-shaped parts of irregular samples (such as concave and convex surfaces, threads, curved surfaces, etc.)
- More than a variety of standard samples required for coating thickness measurement and composition analysis are available
- SDD detector with high counting range and excellent energy resolution
- Automatic switching of collimators and filters
- EDX8000T Plus coating thickness gauge can be used for PCB coating thickness measurement and metal electroplating coating analysis;
- Measured objects include plating, cladding, lamination, coating, chemically formed film, etc.
- It can measure the thickness of various metal coatings such as ion plating, electroplating, evaporation, etc.
- Chrome plating, e.g. plastics with a decorative chrome finish
- Zinc and other anti-corrosion coatings on steel
- Coatings on circuit boards and flex PCBs
- Contact surface of plug and electrical contact
- Precious metal coatings, such as rhodium on gold substrate analysis
- Analysis of functional coatings in the electronics and semiconductor industries
- Analysis of hard material coatings such as CrN, TiN or TiCN
- Can be extended to add RoHS harmful element analysis function, electroplating solution ion concentration analysis
The ESI EDX-8000T Plus XRF
Specifications
- Coating special analysis software, powerful, easy to learn
- Based on the core FP development of the standard-free analysis algorithm to improve the measurement accuracy
- With automatic distance compensation algorithm
- One-click test, one-click print report, test report template can be customized
- Instrument Size: 520mm*400mm*450mm
- Sample Chamber Size: 430mm*370mm*210mm
- Weight: 35Kg
- Element Range: Mg12-U92
- Content Range: 1ppm- 99.99%
- LOD: 0.005μm, up to five layers
- Detector: High resolution Peltier Cooling SDD Detector(FSDD Optinal)
- DPP Analyzer: 4096 Channels
- X-Ray Tube: 50W Micro focus tube
- Measuring directions: Bottom up
- Collimator: Auto selection of φ0.15mm,φ0.2mm,φ0.3mm,Optional 0.1*0.2mm
- X-ray Generator: 0-50KV
- Power supply: 220ACV 50/60HZ
High precision sample platform
- Manual XY table: 80mm*80mm
- Simple and accurate positioning of the sample by hand
- Working Environment: -10°C to 35°C