ACCRETECH - Model HRG200X -Fully Automatic High-rigidity Grinder

The HRG200X is a fully automatic high-rigidity grinder designed for hard semiconductor materials up to 200 mm in diameter. With its ultra-stable construction and dual-axis technology, it minimizes grinding damage and shortens processing times — while maintaining high accuracy and low operating costs. Equipped with an integrated cleaning unit, the HRG200X prevents silicon dust from drying onto the wafer surface. The automatic cleaning function ensures consistently clean processing. The result: a flawless mirror-finish surface, ideal for subsequent manufacturing steps.