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Angstrom Engineering - Model Indium Series -High Aspect Ratio Indium Bumps
Angstrom Engineering’s platforms have been designed to provide fine control of both variables to provide complete flexibility of the types of bumps you’d like to create. Paired with our proven automation and high-throughput capabilities, Indium Series™ becomes a workhorse evaporator for bump bond fabrication that is both easy to use and simple to maintain.
Film Thickness
With the base Indium Series™ platform, you can create films up to 20 um from a single point source, in a single vacuum cycle. The deposition platform can be configured to deposit films up to 100 um.
High Indium Deposition Rates
Highly stable and controllable indium depositions at rates between 1 to 100 A/sec makes for very accurate and repeatable thickness termination. Even at extreme deposition rates, you can maintain indium bumps with excellent sheer strength, small grain size, and good lift-off yield. Finely tuned columnation control is achieved by utilizing throw distance and source aperture control.
Source and Substrate Cooling
Due to Indium's low melting point, keeping the source and substrate fixturing cool is essential for growing textured indium films with small grain sizes and high shear strength. Indium Series utilizes a liquid-cooled substrate stage with the capability of fluid temperatures lower than -70°C, up to +150°C and includes a water-cooled shroud around the source to contain the deposition plume only to the substrate.
Superior Uniformity
Indium Series platforms include a motorized stage with adjustable source-to-substrate distances. For users that require highly controlled film thickness uniformity and lift-off geometry, users can adjust this distance to > 680 mm. This will produce indium films with excellent thickness non-uniformity, and will minimize the edge-effect of the films.