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E-H-Metrology - Model MX 10x Series -High Resolution Wafer Tool
The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds. Before starting to scan the wafer, the gauge recalibrates itself automatically by means of a standard thickness gauge block. A pair of capacitive sensors samples four radial profiles (45 degrees) on every wafer.
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- R&D
- Qualification of processes
- In process control of
- Thickness
- TTV
- Up to four thickness measuring range user selectable
- Dynamic range 100 or 350µm
- Wafer diameter 4", 5" and 6"
- Accuracy 0.1µm
- Resolution 10nm
- Spartial resolution 1mm
- 4 scans
- Software MXNT
