E-H-Metrology - Model MX 102-8 -High Resolution Wafer Tool

The MX base series are manual tools, where some of them can also be used as modules on E+H automatic robot tools or as OEM tools.Please note that all technical tool specifications can be modified to your wishes in accordance with the physical limits of the tool.High Resolution Wafer Tool Up to four thickness measuring range user selectable. Dynamic range 100 or 350µm. Wafer diameter 6` and 8`. Accuracy 0.1µm. Resolution 10nm. Spartial resolution 1mm. 4 scans. Software MXNT.