3D-Micromac microMIRA™ - Laser Lift-Off System

3D-Micromac’s brand-new microMIRA Laser Lift-Off (LLO) system provides highly uniform, force-free lift-off of flexible layers on wafers and large surface areas (up to GEN6) and at high speeds. The system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements. The microMIRA system can be used for a variety of applications, such as device lift-off from glass and sapphire substrates in semiconductor manufacturing as well as OLED and microLED display manufacturing. Additional applications include laser annealing and crystallization for surface modification.