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microPREP™ - High-Throughput Laser Based Microdiagnostics Sample Preparation
The all-new microPREP™ is the first instrument to enable fast, clean, and efficient laser ablation available for the preparation of samples for microstructure diagnostics and failure analysis. microPREP™ provides key benefits of micromachining using ultrashort pulsed lasers, particularly low structural damage, high power densities and targeted precision on the micron scale. microPREP™ 1.1 is suited for TEM, X-SEM, and micromechanical testing in semiconductors, metals, ceramics, as well as compounds.
3D-Micromac microMIRA™ - Laser Lift-Off System
3D-Micromac’s brand-new microMIRA Laser Lift-Off (LLO) system provides highly uniform, force-free lift-off of flexible layers on wafers and large surface areas (up to GEN6) and at high speeds. The system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements. The microMIRA system can be used for a variety of applications, such as device lift-off from glass and sapphire substrates in semiconductor manufacturing as well as OLED and microLED display manufacturing. Additional applications include laser annealing and crystallization for surface modification.
microPREP™ - High-Throughput Laser Based Microdiagnostics Sample Preparation
microPREP™ 2.0 enables high-volume sample preparation of metals, semiconductors, ceramics, and compound materials for microstructure diagnostics and failure analysis. The system can be used for a variety of semiconductor sample preparation applications, including in-plane geometries and bulk samples, cross-sections, box milling for diagnostics of electrical connections and 3D chip-level structures, and full line cuts for complex investigations of complete devices. microPREP™ 2.0 complements existing approaches to sample preparation such as FIB processing and is suited for SEM inspection of avanced packaging devices, X-ray microscopy, atom probe tomography, and micro mechanical testing.
Laser Systems for Photovoltaics
microSTRUCT™ - Laser Structuring Systems
Laser micromachining system for ablation, structuring, cutting and drilling of various materials. Due to the advancing miniaturization in electronics, semiconductor manufacturing and medical technology, it has become increasingly indispensable to possess the capability of machining smaller and finer structures into various substrates.
microSTRUCT™ - Highly Versatile Laser Micromachining Systems
3D-Micromac‘s microSTRUCT™ laser systems are highly flexible laser micromachining system predominantly used in product development and applied research. Superior flexibility makes the systems ideally suited for laser structuring, cutting, drilling and welding applications on a variety of substrates, e.g. metals, semiconductors, alloys, transparent and biological material, ceramics and thin film compound systems.