LLT Applikation GmbH

LLT.microHigh Precision Laser Processing System

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Laser micromachining is not just about the economic production of very small components. High-precision and gentle processing of sensitive products and materials is also important when it comes to quality criteria in medical technology, microelectronics or the jewelry industry. High-quality and burr-free cut edges are just as essential as the output quantity. LLT.micro integrates modularity and technologies to meet these challenges. The compact system combines positioning accuracies of up to ± 3 µm and highly dynamic direct drives with efficient fiber lasers and gentle ultra-short pulse lasers.

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  • Micro cutting, welding, drilling, ablating
  • Up to ± 3 µm positioning accuracy
  • Laser micromaching of 2D, 3D and cylindrical components
  • Process area (X, Y, Z): up to 500 mm x 500 mm x 400 mm
  • Fiber and femtosecond laser with fixed optics and galvo-scanner
  • Highest precision and dynamics for excellent machining results
  • Efficient and gentle for delicate geometries and sensitive materials
  • Wide range of applications for cutting, welding, drilling and structuring processes
  • Precision Cutting
  • Precision Welding
  • Precision Drilling
  • Precision Ablating

Applications: Laser cutting
Laser welding
Laser drilling
Laser ablating
Processable parts: 2D, 3D, tubular parts
Processable material: Metals
Polymers
Ceramics
Glass
Polycrystalline diamonds
Semiconductor materials (e. g. silicon)
PCB materials (e. g. FR4)
Processable material thickness: Up to 2 mm
Path accuracy: Up to ± 3 µm
Repeatability: Up to ± 1 µm
Process area (X * Y * Z): Up to 500 mm * 500 mm * 400 mm
Movement speed: Up to 50 m/min
Laser sources: Fiber laser
Ultra-short pulse laser
(Combined operation possible; Standard wavelengths: 515 nm; 1030 nm)
Process optics: Fixed optics (in combination with galvo-scanner possible)
Galvo-scanner (in combination with fixed optics possible)
Drilling optics
Load capacity of X/Y cross table: Up to 50 kg
Rotation axis (optional): Direct drive
3D-processing (optional): Up to 6 axis
Tilt and swivel axis module
Motorized swiveling processing head
CNC control system: Beckhoff
Machine base: Granite
Dimensions (W * D * H): app. 1.700 mm * 1.600 mm * 2.200 mm
Weight: app. 4.000 kg
(depending on the specific machine configuration)

  • Combination of fiber laser and femtosecond laser
  • Combination of fixed optics and galvo scanner
  • Integration of rotary, tilting, swiveling axes and motorized swiveling processing head
  • Vision system for automatic measurement and inspection
  • Intuitive design of weld paths on live image
  • Pneumatic clamping systems and automatic component handling
  • Filter and cooling systems
  • BECKHOFF CNC controller
  • Ergonomic 22" dual touch screen user interface
  • Handheld control unit for setup work and manual positioning
  • Programming on the machine or at the computer workstation
  • CAD-CAM software for CNC programming