Calyos - Model LHP -Loop Heat Pipes
Calyos specializes in cutting-edge two-phase cooling systems that leverage Loop Heat Pipes (LHPs) to meet high heat flux demands and transport heat over long distances efficiently. This passive heat transfer technology eliminates the need for fans or pumps, ensuring low power consumption, increased lifespan, and reduced weight. Calyos’ LHPs are designed to address the thermal management challenges in diverse applications such as batteries, electronic components, embedded processors, personal computers, power electronics, and servers. As electronic devices shrink and generate more heat, and as new technologies such as GaN and SiC revolutionize the power electronics market, effective thermal management becomes crucial. Calyos integrates advanced physics-based modeling and proprietary wick structures to optimize fluid dynamics and enhance vaporization and condensation processes. The manufacturing process, supported by both in-house facilities and strategic industrial partnerships, ensures that the cooling systems are cost-effective and scalable to meet mass production needs. The robust, maintenance-free designs provide reliable thermal management solutions necessary for modern, high-performance applications.
LHPs provide the ability to not only handle very high heat flux, but also to transport heat over long distances.
- Long distance yet passive transport capability.
- Ability to handle extremely high heat flux with low thermal resistance.
- The latent heat of vaporisation has a high heat transfer co-efficient.
Regardless of the market, the same applications have ever-increasing cooling requirements.
Batteries
Advancements in battery chemistry combined with demanding user needs such as fast charging are resulting in battery packs becoming increasingly difficult to thermally manage.
Electronic Components
New technologies and packaging requirements are resulting in smaller and smaller electronics that produce more and more heat.
Embedded Processors
As vehicles become software defined processors designed for data centers are now required in harsher environments such as defence, aeronautics and passenger vehicles.
Personal Computers
Computers are well established as critical tools to enable modern-day work, they must be ultra-reliable with zero-maintenance and traditional cooling methods have reached their limits.
Power Electronics
Advancements in nano-technology (including GaN & SiC) are creating components with ever increasing heat density, combine this with the need to reduce packaging weight and volume and power electronics are increasingly difficult to thermally manage.
Servers
Advancements in nanometer lithography combined with demanding workloads from AI are resulting in computer processors that are producing more waste heat at an increased density.