MacuSpec - Model AVF Series -Copper Via Fill

The MacuSpec AVF series are advanced via fill copper metallization processes for high density interconnects. The AVF technology allows for minimal surface copper under a wide variety of plating conditions. The unique formula of chemical components and equipment parameters enables customers to plate a broad range of blind micro via sizes in just one bath without the need of flash plate. The filled micro vias created by AVF series baths have an extraordinary degree of repeatability while also adhering to IPC 6012D 3.2.6.2 standard.