Element Solutions Inc products
MacDermid Alpha - Connectors & Interconnect Finishes
Chemical processes for the application of long lasting corrosion resistant coatings for connectors and interconnects. Whether you need durability, long lasting corrosion resistance, or functional final finishes, we have a wide range of chemical processes for finishing connectors and interconnects. The MacDermid Enthone brand of connector finishing technology meets the demands for increasingly complex shapes, finer features, and greater reliability. Through reduced consumption, greater metal selectivity, and increased productivity, every process is designed with the lowest cost of ownership in mind.
MacDermid Alpha - Copper Adhesion Promotion
A wide portfolio of chemical treatments for the copper surfaces that make up the circuitry of printed circuit boards and IC substrates. Adhesion between the innerlayer copper circuits and the resin is critical for long term reliability of the printed circuit or IC substrate. The MacDermid Enthone brand has a portfolio of different copper surface treatments to meet the needs of any application. To compliment the expanding use of low-profile copper foils for high frequency applications, we also provide surface treatment options that are designed specifically for high speed/low-loss applications. MacDermid Enthone’s products are specifically engineered to provide robust reliability across a wide range of resin systems and copper foil types, and can meet the system requirements for any application type.
MacuSpec - Model AVF Series - Copper Via Fill
The MacuSpec AVF series are advanced via fill copper metallization processes for high density interconnects. The AVF technology allows for minimal surface copper under a wide variety of plating conditions. The unique formula of chemical components and equipment parameters enables customers to plate a broad range of blind micro via sizes in just one bath without the need of flash plate. The filled micro vias created by AVF series baths have an extraordinary degree of repeatability while also adhering to IPC 6012D 3.2.6.2 standard.
MacuSpec - Model VF-TH Series - Copper Via Fill
The VF-TH Series are copper plating baths that can simultaneously fill copper micro vias and plate through holes with aspect ratios of up to 5:1 on a wide range of structure sizes with great physical properties. MacuSpec VF-TH technology reduces the number of processing steps without a reduction in reliability. The MacuSpec VF-TH 300 process also eliminates post plating annealing by plating a deposit that is resistant to V-pitting during etching. The copper deposited from the VF-TH Series baths has superior physical properties, passing IPC 6012D, DS, and 6013D standards. These standards require tensile strength to be no less than 40,000 PSI and elongation to be no less than 18%.
Electrolytic Copper
MacDermid Alpha - Model MacuSpec VF Series - Copper Via Fill
The MacuSpec VF Series via filling copper metallization solutions are the production proven standard for via filling in electronic devices used worldwide for over 20 years. With options that are applied to fit every application in the HDI market, the MacuSpec VF processes provide the most stable and consistent via filling available in the market today.