MetaPULSE - Model G -Metal Films System
The MetaPULSE Series is the industry standard for thickness measurements of metal films. The MetaPULSE G System delivers superior performance on all metal films, and is optimized for thin single and multilayer applications that are critical in advanced logic, memory and 3D packaging processes. Rudolph`s patented PULSE™ Technology offers a non-contact, non-destructive technique to measure the thickness of each layer in a multi-layer metal film stack on product wafers, without interference from underlying layers or levels. Unlike optical and x-ray techniques, PULSE Technology measures film thickness using a time-resolved acoustic signal that can be used in active die without the requirement for special metrology test sites.
The MetaPULSE G System uses a laser-based technique that is non-contact, non-destructive and is capable of single and multi-layer thickness measurements.
- Gate metals (W, WSi, Ru)
- Plug & Contact (W, WN, NiPt, Co)
- Barrier (Ti, TiN, Ta, TaN)
- Cu damascene metallization (Seed, EP, CMP)
- Top metal (Al, TiN/Al)
- RF electrode/IDT (Mo, AlN, Pt)
- UBM, RDL (Au, Ni, TiW)
- Magnetic head stacks (NiFe, CoFe, NiCr, Cr, Ru, Au)
- 3D NAND Hard mask (Amorphous Carbon)
- MEMS (Thick Poly, Ge)
- Modulus measurements of low-k, ultra low-k films