MetroSecs/Gem - Model 401 -Wafer Panel Automation
The platform, configurable for either wafer (round) or panel (rectangular) substrates, offers multiple imaging modes, including Clearfind® Technology, a technique for enabling a large process window to detect residue defects on metal and metal defects on organic layers. The combination of substrate flexibility, defect sensitivity and metrology in a single platform reduces capital investment requirements and provides a reliable pathway to transition from wafer to panel-based processes for applications requiring high I/O counts and multiple-chip integration, such as SoC with memory, wireless module and wide I/O memory. Integration with Discover Defect software quickly turns defect data into actionable process control, improves classification and reduces manual review. It enables our customers to develop, learn and analyze new processes reliably while significantly improving their product delivery time to market.
The Metrosecsgem401 system features Clearfind™ Technology to expose non-visual defects that traditional illumination cannot detect,” said Mike Goodrich, vice president and general manager of Process Control Group. “Our customers regularly find defects that had been missed by conventional techniques, including missing or shorted redistribution layer (RDL) lines, un-etched organic film on under bump metallization (UBM) pads, and residual photoresist (PR) and polyimide (PI)
- Fan-out Wafer Level Packaging (FOWLP) / Fan-out Panel Level Packaging (FOPLP)
- 2.5D/Interposers
- Embedded Die/Embedded Interposer
- 3DIC
- MEMS
- Image Sensors (CIS)
- Sub-micron sensitivity in bright field and dark field applications through advanced algorithms
- On-the-fly focus systems for high resolution inspection
- Round wafer (100mm-330mm) and rectangular substrate (up to 515mm x 515mm) support
- LED and Laser illumination modes to capture the widest range of defect types
- Improved capture rate and reduced nuisance rate using Clearfind technology
- Integrated metrology for overlay and critical dimension measurements
- On-the-fly segmentation and CAD-based design rules algorithm