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Milling Pro - Model MIL-1/3 -Micro-Milling
It is a cutting attachment developed so that everyone may cut the foreign body buried in the resin etc. that are difficult up to now and given up in a short time.2μm to 300μm according to the installation on the micromanipulator made of our company and use. It is possible to cut with the foreign body that had been buried in the depth of about 300μm checked visually on the monitor, too. The control of the cutting area and the cutting depth is free according to the selection of the special cutting tool of the attachment according to the object. It is possible to use it not only the resin but also to cut the glass silicon wafer, an iron system metal, nonferrous metals, and the rock, etc.
Most popular related searches
- Digging out of foreign body buried in resin material (revealing, minute IR) and making to collop
- Plane cutting of burying foreign body (head putting out for revealing, minute ATR)
- Stage cutting of thin film on surface of resin at micrometer level
- Wide-ranging plane cutting in constant depth (50μm to)
- Marking to the glass, wafer, and metallic specimen (for FIB processing)
- Pinpoint cutting of IC package or liquid crystal panel encapsulant
- Contact to inner defect (marking-off for X-ray microscope and IC chip cleavage)
