Komax MicroLab - Model 20 -Micrograph Laboratory Testing & Quality Tools
The MicroLab 20 is a fast and reliable micrograph laboratory solution for quick analysis on wires ranging from 0.05 mm² to 80 mm², with customizable reporting options. In comparison with its predecessor, the MicroLab 20 can cut a broader range of wires, spanning from 0.05 mm² to 80 mm². Additionally, it offers the convenience of all-in-one cutting and polishing at the press of a button, along with a double-claw sample holder for precise perpendicular alignment of crimps. The micrograph laboratory MicroLab 20 can also be integrated with other Komax quality tools, such as Crimp Force Monitors, Pull Testers, and Micrometers, to provide a more comprehensive quality report.
Large wire processing range
The MicroLab 20 can cut a wider range of wires compared to its predecessor, ranging from 0.05 mm² to 80 mm², making it an ideal choice for high-mix low-volume applications.
MicroLab 20
Metric
- Dimensions/height: 290 mm
- Dimensions/length: 435 mm
- Dimensions/width: 390 mm
- Weight: 30 kg
- Magnification min.: 0.75 fach
- Magnification max.: 5.0 fach
- Range of application of the cutting/cutting module min.: 0.05 mm²
- Range of application of the cutting/cutting module max.: 80 mm²
- Speed of the cutting disk/cutting module: 3500 r/min
- Feed rate/cutting module: ~0.6 mm/s
- Speed of the polishing wheel/polishing module: 3500 r/min
- Height adjustment range/polishing/polishing module min.: 0.00 mm
- Height adjustment range/polishing/polishing module max.: 5.00 mm
- Processing time/etching module min.: 2 sec
- Processing time/etching module max.: 30 sec
- Field of View: 1.2 mm - 8.2 mm (X-direction)
- Feed Rate Polishing Module: ~6 mm/s
- Adhesive sandpaper outer diameter: 125 mm
- Cutting wheel inner diameter: 12.7 mm
- Cutting wheel outer diameter: 127 mm
- Cutting wheel thickness: 0.5 mm
Imperial
- Dimensions/height: 11.4 in
- Dimensions/length: 17.1 in
- Dimensions/width: 15.4 in
- Weight: 66.1 lb
- Magnification min.: 0.75 fach
- Magnification max.: 5.0 fach
- Range of application of the cutting/cutting module min.: AWG30
- Speed of the cutting disk/cutting module: 3500 r/min
- Feed rate/cutting module: ~0.02 in/s
- Speed of the polishing wheel/polishing module: 3500 r/min
- Height adjustment range/polishing/polishing module min.: 0.00 in
- Height adjustment range/polishing/polishing module max.: 0.2 in
- Processing time/etching module min.: 2 sec
- Processing time/etching module max.: 30 sec
- Field of View: 1.2 mm - 8.2 mm (X-direction)
- Feed Rate Polishing Module: ~0.02 in/s
- Adhesive sandpaper outer diameter: 4.92 in
- Cutting wheel inner diameter: 0.5 in
- Cutting wheel outer diameter: 4.92 in
- Cutting wheel thickness: 0.02 in