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microSTRUCT™Model C -Highly Versatile Laser Micromachining Systems

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3D-Micromac‘s microSTRUCT™ laser systems are highly flexible laser micromachining system predominantly used in product development and applied research. Superior flexibility makes the systems ideally suited for laser structuring, cutting, drilling and welding applications on a variety of substrates, e.g. metals, semiconductors, alloys, transparent and biological material, ceramics and thin film compound systems.

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microSTRUCT™ C offers:

  • Two independent and free configurable working areas
  • Integration of up to two different laser sources
  • Various optical setups
  • Quick changing of work piece clamping unit
  • User-friendly, flexible, upgradeable system control
Configuration packages

Basic

  • One working area
  • Prepared for one laser source with one wavelength
  • Upgrade ready

Advanced

  • Two working areas
  • Prepared for one laser source with up to three wavelengths

Superior

  • Two working areas
  • Prepared for two laser sources with up to three wavelengths
  • Incl. high accuracy vision system, scanner upgrade and preinstalled process gas package

Options

  • Different option packages available on request, e.g. high accuracy package, cylindrical work piece package, etc.