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MiniLab - Model 090 -Glovebox Systems
MiniLab 090 systems are glovebox-compatible for atmosphere-sensitive applications. Tall chambers are ideal for high-performance evaporation, but magnetron sputtering is also available.
MiniLab 090 systems are floor-standing PVD tools for metals, dielectrics and/or organics deposition. All systems contain a box-type stainless-steel chamber with front and rear doors for glovebox integration (allows for both through-glovebox and external service access).
The chamber has a high aspect-ratio, ideal for long working distances for high uniformity coating via evaporative techniques, but systems can also be equipped with magnetron sputtering. A turbomolecular pumping system is standard, for high-vacuum base pressures of better than 5 × 10-7 mbar. Exact configuration is extremely flexible and dependent on customer budgets and applications. Configurations range from a manually operated thermal evaporation system up to a multi-technique tool with fully-automated process control.
- Modular design
- Front sliding door for in-glovebox loading
- Rear door for service access
- Turbomolecular or cryo pumping systems
- Base pressures
- Metals, dielectrics and organics deposition
- Up to 11” diameter substrates
- Touchscreen HMI/PC for system control
- Equipped for easy servicing
- Comprehensive safety features and interlocks
- Cleanroom compatible
- Pumping: Turbomolecular or cryogenic high-vacuum pumps, rotary or scroll backing pumps.
- Gas/pressure: Manual or automatic control via MFCs and throttle valves.
- Load-locks: Single- and multiple-sample.
- Stages: Rotation, heating, cooling, Z-shift, bias and planetary.
- Shutters: Source and substrate, pneumatic or motorised.
- Operation: Manual or automatic via front panels, touchscreen HMI or PC.
- Process: Quartz crystal sensor heads for rate/thickness monitoring or feedback-loop control.
Four-source TE4 thermal evaporation component with source shutters and rotation stage. High power TEC-4A power supply and controller with recipe-based automated control. Quartz crystal sensor head with PC software for rate/thickness monitoring.
Two TE1 thermal evaporation sources for metals and four LTE-1CC components for organics. Source shutters and rotation stage. Evaporation power supplies linked to quartz crystal sensor head and Inficon SQC-310 process controller for automated process control per user-defined rates/thicknesses.
Multi-pocket (e.g., 6 × 7 cc or 8 × 4 cc) water-cooled e-beam source with 5 kW power supply/controller and automated pocket selection. Source and substrate shutters, and rotation. Quartz crystal sensor heads with Inficon SQC-310 process controller for automated process control per user-defined rates/thicknesses.
Up to four water-cooled magnetron sources for 3″ circular targets. RF and DC power supplies with SputterSwitch technology for shared outputs. Source shutters and substrate rotation. Recipe-based power vs. time process control.Magnetron sputtering sources can be added alongside the above techniques.