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MacDermid Alpha Electronics Solutions
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  5. Model MID 100 - Copper Plating

Model MID 100 -Copper Plating

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MID Copper 100: This industry-leading electroless copper chemistry enables manufacturers and designers of Molded Interconnect Devices (MIDs) to selectively metallize plastics activated through laser and 2x molding methods. Our MID Copper will provide unmatched yields and high plating rates from a chemical process with exceptional stability.

MID Nickel 100: Low, Medium, and High Phosphorus nickel systems, all with exceptional stability. Each process will provide best in thickness uniformity combined with corrosion and salt spray resistance.

MID Silver 100: Our newest MID process, MID Silver 100 provides a complete and compelling alternative to nickel+gold as a final finish. Designers and manufacturers can realize significant cost reduction through gold elimination, elimination of nickel, and exceptional electrical performance. Our unique technology will assure environmental/corrosion resistance to meet end use requirements.

MID Gold 100: Designed to operate at low metal concentrations, this MID specific process will allow manufacturers to lower operating costs. Deposits exhibit exceptional solderability, contact resistance, and color uniformity.

Innovative MID Plating Solutions - A high reliability wire bonding technique that can be specifically applied to the rough MID surface to allow for consistent and successful gold thermosonic wire bonding to MID parts.