MacDermid Alpha Electronics Solutions products

The ENTEK Organic Solderability Preservative (OSP) brand is the industry’s most trusted and widely used on the market today! ENTEK PLUS IC is the latest addition to the ENTEK OSP family, providing performance and yield improvement for substrate manufacturers. ENTEK PLUS IC’s industry leading thickness capability allows unrivalled shelf life of 24 months, providing supply chain flexibility and performance risk elimination associated with other OSP’s. With proven resistance to de-flux materials, ENTEK PLUS IC OSP maintains thickness through cleaning operations, delivering reliable performance for subsequent assembly operations ensuring yield maximization.

Widely specified immersion tin final finishes for consistent reliability. Our immersion tin processes represent the pinnacle of trusted reliability for tin metal final finishes in the automotive electronics segment and beyond. Whether you are building boards for press fit technologies, backplanes, or fine pitch applications, the ORMECON® and MacStan HSR processes can deliver excellent and consistent results that can be counted on to protect board surfaces before and during assembly operations.

ALPHA OM-535 was developed with the aim to improve the solder joint performance, both for drop shock and thermal cycling, versus the existing low temperature products on the market. The enhanced properties of low temperature SBX02 alloy combined with the advanced  chemistry performance of OM-535 enables  the formation of a better solder joint  by improving the mechanical performance and solder joint cosmetics using low temperature process settings.

ALPHA OM-353 is designed to meet market segments requiring ultra-fine feature applications. It has been tested to give excellent printing performance down to 180μm pad size.

ALPHA tensoRED Master Tensioning Frame is the latest development in Alpha’s stencil range of state-of-the-art printing stencils. ALPHA tensoRED has been designed to reduce the total cost of ownership of stencils compared to other systems by creating tension without the need of air pressure being applied to the frame. Due to its innovative design, ALPHA tensoRED enables a higher and more even tension, compared to ALPHA Tetra Frames, without the need of air pressure being applied to the frame. This results in reduced maintenance costs and improved reliability.

ALPHA Precision Milled, Multi-Level Stencils are the latest in Alpha’s range of state-of-the-art printing stencils. They are designed to enable optimal control of the paste deposits when assembling boards containing a wide variety of component sizes. They allow greater flexibility in the transition from one thickness to another and improved surface quality. ALPHA Precision Milled Stencils are designed to produce the best printing performance by enabling less visible paste smearing and improved repeatability of print deposits. They allow reduced pressure to be used when printing stepped stencils and increased flexibility in design of the “Keep Out ” area.

Pattern the front-side grid, or a back-side structure with this 100% solids inkjet resist. Cured on the fly at high productivity using inexpensive printers, the resist is chemically and thermally stable, allowing for less than 40 micron patterns and zero undercut etching. Easy stripping with Helios Inkjet Stripper and etch with Helios ARC Etch chemicals. High temperature ink tolerance overcomes problems of older hot-melt ink technology.

ALPHA EF-2210 is VOC-free, halide-free, rosin/resin-free, low solids no-clean flux which provides the highest activity of any VOC-free Bellcore SIR compliant flux for defect-free soldering. It is formulated with a proprietary mixture of organic activators which deliver excellent wetting and top-side hole fill, even with OSP coated bare copper boards which have undergone prior thermal excursions. Several proprietary additives are also formulated into EF-2210 which act to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solderball generation. The formulation of EF-2210 is also designed to be more thermally stable; thereby, reducing the occurrence of solder bridging.

ALPHA Cleanline 7000 is a very low residue flux core wire solder designed for no-clean hand soldering applications. The flux core provides sufficient activity to solder successfully to bare copper and other demanding applications. The unique blend of resin and proprietary non-halide activators provide rapid wetting, while leaving minimal levels of post-soldering residue. This residue is optically clear, soft and easy-to-probe, tack-free and non-corrosive. In some circumstances and over time the residue can have a white milky appearance.