Amphenol Communications Solutions (ACS)
Paladin - Model HD 224Gb/s -Backplane Interconnect System
Industry leading density and performance - your path to 224GB/S. The Paladin® HD interconnect system provides world class bandwidth from 112Gb/s to 224Gb/s with industry leading density, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin® HD utilizes a balanced pair structure, built with individually assembled and discretely shielded differential pairs with a revolutionary hybrid board attachment for maximized density and electrical performance. Paladin® HD supports all system architectures, including backplane, orthogonal, board to cable, and cable to cable topologies. Paladin® HD`s unique mating interface allows for consistent performance in a de-mated condition, critical for next generation systems.
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- Industry leading SI performance supporting 224Gb/s data rates
- Revolutionary hybrid board attach technology to enable broadside coupled PCB launch while maintaining density advantage
- Exceptional density to maximize signal count and minimize air flow restrictions
- Impedance control over 1.00mm connector de-mate
- Backwards compatible with Paladin® HD for direct upgrade path
- World class SI performance at 224Gb/s
- Industry leading density at 224Gb/s
- Consistent SI performance over the connectors mechanical mating range
- Linear transmission through 67GHz
- All system architectures supported; cables can terminate to other 224Gb/s product lines
- Maximized routing channels
- Mechanically matched and electrically balanced signals within each differential pair
- Revolutionary hybrid board attachment: compression mount signals and press-fit grounds
- Symmetrical mating interface
- Common differential pair components
- Mate and footprint compatible with Paladin® HD and leverages proven differential pair architecture
- Greater than 40dB IL to XTalk margin at Nyquist for all architectures
- 144 Differential Pairs within 1RU rack spacing orthogonally, including room for airflow
- Less than 5? impedance variation and minimal crosstalk impact over full wipe range
- No resonances through 67GHz
- Board-to-board, board-to-cable, PHD2 cable-to-cable, and PHD2 cable-to-Ultrapass (224Gb/s)
- Route 2 or more high speed differential pairs per layer
- Skew-less design with low mode conversion, while maintaining conventional trace breakout
- Optimized for SI performance, density, and routing
- Supports both 90° and 270° orthogonal applications
- Enables mass production scale with repeatable assembly steps for all configurations
- Mate compatible upgrade path from 112Gb/s to 224Gb/s with reliable and robust design features