Amphenol Communications Solutions (ACS) products

Industry leading density and performance - your path to 224GB/S. The Paladin® HD interconnect system provides world class bandwidth from 112Gb/s to 224Gb/s with industry leading density, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin® HD utilizes a balanced pair structure, built with individually assembled and discretely shielded differential pairs with a revolutionary hybrid board attachment for maximized density and electrical performance. Paladin® HD supports all system architectures, including backplane, orthogonal, board to cable, and cable to cable topologies. Paladin® HD`s unique mating interface allows for consistent performance in a de-mated condition, critical for next generation systems.

Amphenol`s Millipacs® is a 2.00mm grid Interconnection system in hard metric configuration designed in accordance to IEC 917, IEC 61076-4-101, Telecordia GR-1217-CORE standards and fulfills Compact PCI bus architecture. Millipacs® high temperature series addresses the market requirements for Backplane connectors compatible for higher operating temperature applications. With growing density and electronics packaging, temperature rise is posing challenges to the users. Besides standard operating temperature range of -55°C to +125°C, options for extended temperature range of -65°C to +175°C and smoke and fire compliant standard EN45545 is available.

High density / high speed / dual-beam contact / Uscar-2 compliant board-to-board connector. Amphenol FCI Basics DensiStak™ connector is designed with its 11 rows 1000+ high density pin count, high speed up to PCIe® Gen 4 with 16Gb/s. Reliable dual-beam contact system, compact size with pitch 0.80mm x 1.25mm, USCAR-2 compliant, and optional shields.

Amphenol`s Conan® 1.00mm is a mezzanine connector designed for industrial applications and harsh environments. Conan® 1.00mm provides a mechanically secure, high-density electrical interface between parallel printed circuit boards. Its unique design with an audible `click` sound enhances the security and ease of use. The polarization ensures proper alignment during blind mating, and the surface mount hold-down increases mechanical strength after soldering and lead-in. It has good mating performance, rugged design and is under 70 positions.

Amphenol`s FloatCombo™ are 0.50mm pitch floating board-to-board connectors that support stack heights from 8.0mm to 30.0mm. These connectors come with 4 independent power contacts and 20 to 140 signal contacts, where the power contacts support 5A per pin and the signal contacts provide high-speed data rates up to 10Gb/s or 16Gb/s. The compact connector design makes it suitable for use in applications with large current, vibration, and space-saving requirements, such as ADAS, ECUs, BMS, OBC, invertor applications in Automotive and LED Display, LED Monitor, Robotics applications in Industrial.

MicroSpaceXS™ Waterproof connector platform`s unique design meets USCAR-T2V2 and LV214 Severity 2 specifications. These 1.27mm pitch connectors come with a current rating up to 3A per contact making them ideal for higher power applications. MicroSpaceXS™ waterproof connectors are available in staggered pin configuration and in Wire-to-Wire Flying configurations. These connectors are offered in tin or gold plating.

FCI Minitek® Pwr 4.2 TPA connector system ensures that the terminal is fully seated in the housing and that the terminal will not back out of the housing during mating or when in use. AFCI TPA aligners are optional and can be used as an add on part.