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TJNE - PCB Gold Plating System for Enhanced Conductivity and Corrosion Resistance

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TJNE's PCB Gold Plating DSA is an advanced gold plating system designed for printed circuit boards. This process is pivotal for improving the conductivity, corrosion resistance, and solderability of PCBs, ensuring dependable electronic connections. The system is grounded in electrochemical principles, utilizing a gold electrolyte solution and electric current to deposit gold ions on PCB surfaces, resulting in a uniformly adhered gold layer. Key components of the system include a gold plating tank, power supply, rectifier, PCB fixtures, and a control panel. These ensure precise monitoring and regulation of plating parameters. The system's robust mechanical design and high-speed plating capabilities provide reliable performance, supporting applications in consumer electronics, telecommunications, automotive, industrial, and medical devices. The system is capable of handling PCBs up to 500mm x 500mm, withstanding rigorous testing standards, and includes features like digital current regulation and automatic replenishment for optimal plating conditions.
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Product Overview: Improve the conductivity, oxidation resistance, and wear resistance of circuit boards to meet their use needs in special occasions.
Product features: excellent performance, good electrocatalytic performance, antioxidant capacity, and stability.
Highlights: long life, low energy consumption, superior plating uniformity, low comprehensive use cost, and high-cost performance.
Applicable scenarios: circuit board gold plating
Application conditions: electrolyte acidic/cyanide system, gloss agent & other additives Au: 4-10g/L, CN: low concentration, PH: 4-5; temperature 40℃-60℃;
Current density: 0.1-1.0ASD; average 0.2ASD
Product after-sales and service: We provide timely and high-quality new anode manufacturing and old anode recoating services globally.

PCB Gold Plating DSA is a specialized product offered by TJNE, a leading manufacturer and supplier in the industry. This product is designed for professional buyers and global distributors seeking high-quality gold plating solutions for printed circuit boards (PCBs).

It is a process that involves the deposition of a layer of gold on the surface of PCBs. This plating technique enhances the conductivity, corrosion resistance, and solderability of the PCBs. It is crucial for creating reliable electronic connections and ensuring the overall performance of the PCBs.

The gold plating process is based on electrochemical principles. It involves the use of a gold electrolyte solution and the application of an electric current to facilitate the deposition of gold ions onto the PCB's surface. The chemical performance of the process ensures that the gold layer is uniform and adheres firmly to the PCB, providing excellent conductivity and protection against oxidation.

It consists of several components, including a gold plating tank, power supply, rectifier, PCB holding fixtures, and a control panel. The tank houses the gold electrolyte solution, while the power supply and rectifier deliver the necessary voltage and current for the plating process. The PCB holding fixtures securely hold the PCBs during plating, and the control panel allows for precise control and monitoring of various parameters.