PulseForge - Model 1200 -Photonic Curing Tool
The PulseForge 1200 from NovaCentrix offers state-of-the-art photonic curing in a low-cost, compact chassis without giving up performance or safety. Designed to reflect the experiences of our own team of scientists, the PulseForge 1200 incorporates features determined to be essential for peak performance and safety. With advanced multi-touch user interface and wide control of processing parameters, users can quickly optimize material configurations and process conditions. Backed by world-class process engineering and support, the PulseForge 1200 is the ideal tool for research and development of printed electronics.
Photonic Curing Tool for Research and Development
The NovaCentrix PulseForge 1200 photonic curing tool processes high-temperature materials on low-temperature substrates, and is optimized for use in materials and applications development. NovaCentrix has particularly focused on safety from the hazards of outgassing samples and extreme light in the PulseForge 1200 tool design. The sample processing drawer of the PulseForge 1200 is protective of the hazards of extreme light impacting the eyes of users and also operates at slightly less than room pressure with sample off gassing being sent through HEPA filtration before going into the exhaust duct. Based on the same engineering found in the production-capable PulseForge 3200 tools, the process conditions developed with the PulseForge 1200 will be sure to scale straight into pilot and volume production. When combined with NovaCentrix`s SimPulse® thermal stack simulation package for predicting the time-temperature history of each layer in a thin film stack during photonic curing, the PulseForge 1200 comprises the ideal R&D platform for photonic curing development.
- Effective with any print method, including inkjet, flexo, gravure, aerosol, screen print, and spin-coat.
- Can be used with nano and micron-scale ink materials.
- Sheet resistances below 10 milliohms/square.
- Ideal for use with flexible, low-temperature substrates including polymers and paper.
- Ability to create custom, composite pulse structures with high precision and accuracy.
- High-accuracy reflector optics for exceptional (>98% outside of edge effect) uniformity.
- Water-cooled lamps.
- PulseForge tools enable the use of new ink materials, including Metalon® ICI copper-oxide reduction inks.
- Processing times <
- Capable of processing depositions >30 micron.
- Ability to dry and sinter depositions in excess of 20 microns thick.
- User-selected pulse power and energies.
- Next-generation touch-screen user interface.
- Automated, synchronized sample processing stage with multiple operating mode.
- Peak radiant power delivered (kW/cm2) 4.9
- Max radiant energy delivered (J/cm2) 46
- Max voltage to lamp(s) 480
- Effective max linear processing speed (meters/min)* 30
- Curing dimension per pulse (mm)** 75 x 150
- Max area cured per sample (mm)** 300 x 150
- Pulse length range (microseconds)**** 25–100,000
- Pulse length increment (microseconds) 1
- Minimum pulse spacing (microseconds) 20
- Max pulse rate >kHz
- Output spectrum (nm) 200–1500
- Uniformity of exposure (point to point) +/- 2% or better