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Angstrom EngineeringModel Quantum Series -Physical Vapor Deposition Platforms Cover

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Angstrom Engineering has developed a series of platforms that provide quantum computing hardware pioneers a means to reliably and confidently create superconducting circuits, and their supporting hardware, in a highly repeatable and automated framework. 

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Josephson Junctions Super Conducting Sputtering, Indium Bumps

The Quantum Series® of physical vapor deposition platforms cover a variety of fabrication processes vital in quantum computing research and commercial development.

A Quantum Series® system can focus on one fabrication process or include several in situ. We regularly manufacture and deliver Quantum Series® systems specific to aluminum-based Josephson junctions, sputtering superconducting materials like niobium, as well as systems dedicated to fabricating indium bump bonds.

Overview

The Quantum Series® of physical vapor deposition platforms cover a variety of fabrication processes vital in quantum computing research and commercial development. A Quantum Series® system can focus on one fabrication process or include several in-situ. We regularly manufacture and deliver Quantum Series® systems specific to aluminum-based Josephson junctions, sputtering superconducting materials like niobium, as well as systems dedicated to fabricating indium bump bonds.

Grow Uniform Tunnel Junctions
  • The Quantum Series® Josephson junction fabrication platform employs a number of features to ensure repeatable growth of pure, uniform oxide layers.
  • We can accommodate static oxidation, dynamic oxidation, as well as plasma and UV/ozone oxidation.
  • We employ a robust gas purification system, real-time oxide growth monitoring, and direct optical wafer temperature monitoring allowing oxides that are customizable, repeatable, and reliable.  
Precise Shadow Evaporation
  • Angstrom has refined our design to create an extremely repeatable, versatile, and robust fixture.
  • Process enhancements are available, including substrate heating, cooling, and biasing.