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Smit - Plasma Enhanced Chemical Vapour Deposition Systems
Smit Thermal Solutions is proud to offer industry-leading Plasma-Enhanced Chemical Vapor Deposition (PE-CVD) equipment, featuring our proprietary expanding thermal plasma (ETP) technology. With this technology, we enable fast and efficient deposition of thin films at a high rate of greater than 1 µm/min. Our PE-CVD equipment is specifically designed for cost-effective manufacturing, making it an excellent choice for a range of industries.
Our PE-CVD equipment supports the deposition of various materials, including a-Si, Silicon Nitride, Silicon Oxide, DLC, Al doped ZnO, AlOx, and others, offering you flexibility in your manufacturing process. Additionally, we provide tunable layer properties, allowing you to create dense or highly porous coatings that meet your specific requirements.
Our PE-CVD equipment uses a remote plasma, ensuring that there is no damage to the substrate from high-energy ion bombardment. This makes it an excellent option for delicate substrates, such as those used in the display and electronics industries. Furthermore, our equipment is designed to support both single-side and dual-side coating, ensuring maximum flexibility in your manufacturing process.