ACCRETECH - Model PG3000RMII -Polish Grinder for Wafer Thinning
The PG3000RMII polish grinder from ACCRETECH is a specialized tool for semiconductor manufacturing, combining wafer thinning and defect removal capabilities in a single, integrated system. Tailored for high-volume production, it handles wafers up to 300 mm with precision. The system's design emphasizes efficiency through the integration of multiple processing steps, leading to stable and consistent results. The RM200/300 module specifically enhances the polishing process, ensuring optimal performance. This equipment is particularly suited for applications requiring rigorous quality control and increased throughput, making it indispensable for businesses focusing on efficient semiconductor fabrication.
The PG3000RMII from ACCRETECH is a highly precise polish grinder solution that combines wafer thinning and defect removal for wafers up to 300 mm in a single system. By integrating multiple process steps into one device, the system achieves maximum efficiency and stable results – ideal for use in high-volume manufacturing.
Maximum Efficiency Through Integrated Processes
- Two processing steps in one machine: thinning and polishing
- Flawless results thanks to stable process control
- Wafer thinning down to 15 µm thickness – for modern applications with ultra-thin substrates
- High throughput for mass production
- All processes on one chuck – no wafer transfer necessary
The RM200/300 module optimally supports polish grinding by:
- • Removing protective tape from thin wafers
- Precisely mounting wafers onto dicing frames