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PulseForgeModel 3200 -Photonic Curing Tool

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The PulseForge 3200 is able to meet or exceed oven performance in a small fraction of the time, process a wide variety of material/substrate combinations, process large areas, integrate with existing and new roll-to-roll systems or conveyors, and work with challenging low-temperature substrates like PET and paper. Because of these attributes, the PulseForge 3200 is the right manufacturing tool for printed electronics developers and manufacturers seeking to cut product costs and improve product innovation.

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Advanced Curing for Printed Electronics

The PulseForge 3200 optimizes the application of photonic curing for processing metal-based inks on flexible substrates. Applications include conductive interconnects and patterns for printed photovoltaics, displays, smart packaging, and RFID. The PulseForge 3200 is designed for roll-to-roll and conveyor-based material processing. Whereas ovens require minutes, the PulseForge tool sinters metallic inks in milliseconds on low-cost substrates such as PET and paper. This tool is ideal for full-volume production as well as application development. The PulseForge 3200 is CE marked for use in EU countries.

Application Performance and Versatility

The PulseForge 3200 commercial processing tool dries and sinters printed electronics in a wide-web format with widths from 150 mm (6") to greater than 4.8 m (192").The tool is auto-synchronized to line speeds from stationary to over 100 meters/minute (300 FPM), but speeds up to 500 meters per minute are achievable curing thin prints of some inks. The high pulsed power system achieves very high temperatures for very short times in the conductive film, without damaging the underlying low-temperature substrate; e.g. plastic film or paper.

Print Methods.
Effective with the most widely used print methods, including inkjet, flexo, gravure, aerosol, and screen print.

Substrates.
Processed substrates include PET, paper, polyethylene, polyimide, and many others.

Performance.
Conductivity of inks processed in

Resistivity.
Resistivities below 15 milliohms/square have been attained with the PulseForge 3200 on PET.

Ink Materials.
PulseForge tools enable the use of new ink materials, including Metalon® copper inks.

Development and Manufacturing.
PulseForge tools can be used for material and application development as well as volume manufacturing of printed electronic devices.
Facilities and Integration

The PulseForge 3200 achieves High Temperature Processing on Low Temperature Materials™ using pulse-width modulated light with exposures as short as 30 µs. This is accomplished using precise real-time control of the current delivered to proprietary lamps. The pulse duration and energy waveform can be adjusted on-the-fly by feedback on product processing and performance sensors.

Modular.
The 3200 consists of small-footprint modules, most of which can be located away from the main manufacturing line. This eases space constraints in the critical production area.
Connections.
The modules are connected via umbilicals that house the required power, cooling, and communication cables.
Integration.
PulseForge tools can be fully integrated with existing or built-for-purpose print systems and production lines.
Pulse Waveform Shaping.
The PulseForge micro-pulse capability creates custom pulse structures, with each pulse acting inside the thermal equilibrium time of the preceding pulse.
  • Peak radiant power delivered (kW/cm2)  5.9
  • Max radiant energy delivered (J/cm2)  46
  • Max voltage to lamp(s)  480
  • Effective max linear processing speed (meters/min)*  >100
  • Curing dimension per pulse (mm)**  150 x (150 – 4800)***
  • Max area cured per sample (mm)**  Unlimited
  • Pulse length range (microseconds)****  25–100,000
  • Pulse length increment (microseconds)  1
  • Minimum pulse spacing (microseconds)  20
  • Max pulse rate  kHz
  • Output spectrum (nm)  200–1500
  • Uniformity of exposure (point to point)  +/- 2% or better