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3D image sensing 3D sensors to revolution imaging for consumer, automotive, drones and industrial applications
A new world of advanced human/machine interface is emerging leading to brand new applications such as augmented reality (AR), virtual reality (VR), and facial-recognition security systems.
3D cameras are the backbone of this revolution.
CMOS Image sensors adapted to Near Infrared (NIR) by designAt NIR wavelength, CMOS image sensor still represents the most viable solution to address mass market applications despite the relative transparency of Silicon to photons. In comparison, compound (like InGaAs) or Quantum Dot solutions represent more expensive and less mature solutions.
Nevertheless, because of this transparency of silicon in infrared, several technics co-exist to increase the pixel sensitivity:
- Deep Trench Insulator (DTI) to isolate pixel from its neighbors
- SOI pixel substrate for light trapping
- Back-scattering techniques to increase the distance of light in silicon
- Pixel depth increase
Advanced Stacking Technologies with Smart Cut™ SOI
The 3D integration has demonstrated significant advantages:
- Higher Performance and Density
- Higher Functionality
- Smaller Form Factor
- Cost reduction
- Enabling optimized partitioning