Chengyi - Model ENIG BGA -Surface Mount PCB Board

BGA is a surface mount package for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. BGAs can provide more interconnect pins than dual in-line or flat packs, each with solder balls. All connections are distributed in a uniform surface grid or matrix on the component. The entire underside of the device can be used, not just the perimeter.

On average, the leads are also shorter than peripheral-only types, resulting in better performance at high speeds.

BGA PCB Board is not like ordinary PCB. They require the latest manufacturing, assembly and testing techniques. We have the perfect solution for all your BGA PCB needs. We are technically well equipped to supply any complex or simple BGA PCB or PCBA.

• Application area: Consumer electronics    
• Product feature: BGA/Black ink
• Layer: 4    
• Surface treatment: ENIG
• Material: FR4    
• Line width/Line space: 0.99/0.14mm
• Thickness: 1.2mm    
• Min hole φ: 0.20mm

Advantages of BGA PCB Board:

1. Effective use of PCB space. Using a BGA package means fewer components involved and a smaller footprint, and also helps save space on custom PCBs, greatly increasing the effectiveness of PCB space.
2. Improve thermal and electrical performance. Heat dissipation is easier due to the small size of the PCB based on the BGA package. When the silicon wafer is mounted on top, most of the heat can be transferred down to the ball grid. When the die is mounted on the bottom, the backside of the die is connected to the top of the package and is considered one of the best ways to dissipate heat. The BGA package has no pins that can be bent and broken, which makes it stable enough to ensure large-scale electrical performance.
3. Increase manufacturing profit on the basis of welding improvement. Most BGA package pads are large, which makes large area soldering easier and more convenient. As a result, the manufacturing speed of PCBs increases as the manufacturing yield increases. Also, when larger pads are used, rework is easy.
4. Less damage. BGA leads consist of solid solder balls that are not easily damaged during handling.
5. Reduce costs. All of the above advantages help reduce costs. Efficient use of PCB space offers opportunities for material savings, while improving thermoelectric performance helps ensure the quality of electronic components and reduce defects.