SVCS Process Innovation s.r.o.
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furnace
cleanroom product
temperature profiling
level controller
atmospheric diffusion
cleanroom atmosphere
cleanroom
HEPA
safety system
Atmospheric Processes
- Diffusion (drive-in) high temperature procesess
- Doping from solid, liquid and gaseous dopant sources e.g.: BBr3, B2H6, POCL3, PH3, BN
- Various thermal processing e.g. annealing, sintering
- Pyrogenic Wet Oxide with External Burning System
- Wet Oxide with ultra pure steamer
- Dry Oxide
- HiPOx (High Pressure Oxide)
LPCVD Processes
- Silicon nitride
- Low temperature oxide (LTO)
- High temperature oxide (HTO)
- TEOS oxide
- Polysilicon, with tilt/flat temperature profile
- Doped polysilicon
- Oxynitride
PECVD Processes
- Silicon nitride (incl. anti-reflective SiN solar cell coating)
- Silicon oxide
- Oxinitride
Wafer Handling Automation Partial automation
- Stand-alone cassette to boat wafer transfer system
Full automation
- Boat elevator
- Fully automated stocker with built-in elevator and wafer transfer system
Typical configuration for Boat Elevator is 5 boats each with 50 slots each (200 mm wafers) and 6 boats (150 mm wafers).
In case of stocker, the system includes built-in wafer handling robot and the boat elevator. The stocker is integrated into the horizontal furnace and stores loaded and unloaded cassettes for a smooth continuous and fully automatic furnace operation.
- Maintenance friendly mechanical design
- State of the art modular control system, in-house designed and manufactured
- 10,4“ high-res touchscreen for operator interface
- Up to 4 stacked quartz or SiC tube reactor chambers for various procesess
- No thermal interference between different tubes
- Contactless fully automated boat-in-tube loading both cantilever or softlanding configurations
- Independent tube level control system
- HW safety interlocks independent on main CPU
- HEPA or ULPA filtres installed in load station
- Boat elevator and wafer handling automation
- UHP face seal fittings and welds for connections
- UHP orbital weldings made in 100/10 Cleanroom
- Sample dimensions W x D x H (mm)5600 x 2600 x 1000
- Wafer size (mm)150, 200, 300 or any custom size
- Wafer load100+
- Heating system 3 or 5 zone
- Flat zoneUp to 1067 mm (42″)
- Process temperature200°C to 1300°C, ± 0.5°C across flat zone
- Power consumption18kW – 30kW per tube
- Power supply
- (adapted to power grid of destination country)150 mm: 3-phase, 400/480VAC, 140A, 50/60 Hz
- 200 mm: 3-phase, 400/480VAC, 160A, 50/60Hz
- Clean dry air70 – 110 psig (4,8 to 7,6 bar)
- Cooling water40 – 60 LPM
- Exhaust210m³/h per tube
- OptionsBoat elevator and wafer handling automation