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TuffbondModel 321 -Low Viscosity, General Purpose Resin Epoxies for Potting and Encapsulating

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Tuffbond 321 is a flexible, low viscosity, general purpose resin system used for casting, potting, and encapsulating of electrical and electronic components. This unique product has been formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties.

  • Substrates: Wood
  • Substrates: Plastic
  • Substrates: Stone
  • Substrates: Metal
  • Applications: Potting
  • Substrates: Composite
  • Applications: Bonding