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Lasing - Model LS-HDPRO -Ultra Compact All-in-One Laser Micromachining System
FromLasing, S.A.
LS-HDPRO Versatile ultra-compact all-in-one laser micromachining system ready for nanosecond or femtosecond laser processing where nanometer resolutions and laser spot sizes down to 1 micron are required. The laser head integrates external power control, 2D galvanometer scanning, high quality vision system, autofocus laser sensor and all the electronics necessary to drive up to 4 high performance stages (XYZ-Rot).
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- Working Area: 100 mm x 100 mm x 25 mm
- Resolution: Down to 20 nm (XY), 0.1 μm (Z)
- Repeatability: ± 0.3 μm (XY); ± 0.1 μm (Z)
- Accuracy: ± 2.5 μm (XY); ± 1 μm (Z)
- Available Laser Sources: Green-UV ns or IR fs laser
- Substrate Holder: Custom
- Minimum Laser Spot Size: Down to 1 μm
- External Dimensions: 450 x 750 x 1000 mm (W x D x H)
- Weight: Aprox. 120 Kg
- Control Unit: Integrated PC with 27″ monitor
- Fixed optic head with automatic objective´s change.
- Co-lineal vision system with motorized optics.
- Co-lineal surface measurement laser system with close-loop correction or 2D scanning option.
- Automated camera calibration.
- Automated feature camera recognition for precision aligment and rotation compensation.
- Based on CAD GUI enviroment (Import DXF, DWG, DWT, ACIS… files).
- Class 1 high end enclosure.
- Solar Cell Processing
- Wafer scribing and dicing
- Laser cutting and drilling
- Marking
- Micromachinning
- Via Hole Drilling
- Ceramic Processing
- Welding
- 2 Photon Polymerization
- Thermal Treatment
- ITO Patterning
- OLED Processing and much more…