EBARA Precision Machinery Europe GmbH (EPME)
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EBARA - Ultra Fine Plating Systems
Semi and fully automated systems – the UFP300A or UFP300AD. The wafer plating systems enable fast, high performance processing for depositing fine conductive patterns on wafers. This includes bumps, pillars, re-wirings and through silicon via structures, which are essential for packaging techniques.
- High throughput
- Versatility
- AI detection control
- High efficiency
- Cost and space saving
- Compact solution
- Redistribution
- Bumping
- IC Advanced Packaging
- Wafer Level Chip Packaging
- Multi-layer Applications
- Patterned Plating (Copper, Nickel, Gold, Solder)