Machine Vision Products, INC.
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- MVP - Model 900 W/ALW - Wafer ...
MVP - Model 900 W/ALW -Wafer Inspection Solution (100-300mm)
The MVP 900 is available in two configurations for Wafer Inspection. The ALW supports full automation integrated with a single arm robot and a pre-aligner. Wafer sizes are supported from 100 through 300mm. The 900 W is a low cost manual load configuration with same side load/unload.
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The 900 W/ALW is configured with high resolution optics and custom lighting providing the basis for proprietary high performance algorithms to detect:
- Contamination/Discoloration
- Delamination
- Foreign Material/Debris
- Scratches/Cracks
- 2D and 3D Capable
- 100, 150, 200 and 300mm Wafers
- 0.35um to > 3.4um Optical Resolution
- Surface Inspection
- Bump Inspection 25um to 500um
- Multi-Spectral Lighting
- Real-Time Process Monitoring
- High Resolution Laser Profiler
- Manual Loading
- Automatic Loading
- 3rd Party Handlers for SMIF, FOUP
- Vacuum
- SECS/GEM
- XML Map Output for Downstream Sorting
- Ink Marking for Defect Locations
