2 products found
Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership. Optimized for extended pad and disk life. Diamonds secured with both chemical and mechanical bonds for superior retention.Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for superior diamond retention, with controlled diamond placement and ...
Outstanding planarization, Exceptional within-die range, Low defects, Stable repeatable process, Wide process window, Reduced step height. The 3M Fixed Abrasive P7100 sub pad provides improved process performance and stability matched to the extended life of 3M's fixed abrasive rolls. This enables improved process performance, minimized consumable changes and reduced tool ...