Applied Materials, Inc. products
Semiconductor
Applied - Model Aera4 - Mask Inspection System
The Applied Aera4 Mask Inspection system is a fourth-generation 193nm-based inspection tool unique in combining true aerial imaging with cutting-edge high-resolution imaging. Equipped with a new lithography-grade lens, the Aera4 system demonstrates improved signal-to-noise for both standard high-resolution applications and aerial inspection, making it the tool of choice for 1x nm technology nodes and for early-production EUV mask inspection. The system performs highly sensitive mask inspection, as required for double- and quadruple-patterning lithography technologies, while maintaining a very low false alarm rate.
Nokota - Model ECD - Electrochemical Deposition Systems
The Nokota system expands the Applied Materials suite of electrochemical deposition systems with a high-productivity wafer-level packaging tool that delivers best-in-class performance for the full range of plating steps used in diverse packaging schemes. These range from flip chip and wafer-level chip-scale packages to 2D and 3D fan-out, 2.5D interposerdesigns, and through-silicon via. Systems are available for 150mm, 200mm, and 300mm operation, and for simultaneous processing of 150mm/200mm and 200mm/300mm wafers. Copper, tin/silver alloy, nickel, gold, tin, and palladium are the metals most commonly used, although others can be accommodated.